Author Search Results

1

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

Nanoindentation characterization of Sn-Ag-Sb/Cu substrate IMC Layer subject to thermal aging

by Shualdi W., Bais B., Ahmad I., Omar G., Isnin A.
Published 2023

Other Authors: “...36194999100...”

Conference paper

2

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

by Shualdi W., Ahmad I., Omar G., Isnin A.
Published 2023

Other Authors: “...36194999100...”

Conference paper