Insulated Cu wire free air ball characterization

by Leong H., Yap B., Khan N., Ibrahim M.R., Tan L.C.
Published 2023

Development of insulated Cu wire ball bonding

by Leong H.Y., Mohd F.Z., Ibrahim M.R., Kid W.B., Khan N., Kar Y.B., Tan L.C.
Published 2023

Characterisation of insulated Cu wire ball bonding

by Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.
Published 2023

Stitch bond strength study in insulated Cu wire bonding

by Leong H.Y., Yap B.K., Khan N., Ibrahim M.R., Tan L.C., Faiz M.
Published 2023

Analysis of Transmission Performance for Fine Pitch Interconnect

by Leong H.Y., Yap B.K., Chin L.P., Zuraida E.E., Awang Mat Z.
Published 2024