Pseudocapacitive performance of vertical copper oxide nanoflakes

by Endut, Z., Hamdi, Mohd, Basirun, Wan Jefrey
Published 2012

Effect of moisture on underfill interfacial adhesion and packages flexural strength in flip chip packaging

by Endut, Z., Ahmad, I., Zaharim, A., Sukemi, N.M.
Published 2017

Supercapacitance of bamboo-type anodic titania nanotube arrays

by Endut, Z., Abd Shukor, Mohd Hamdi, Basirun, Wan Jefrey
Published 2012

Dicing laminated wafer for QFN 3D stacked die packaging

by Abdullah, S., Endut, Z., Ahmad, I., Jalar, A., Yusof, S.M.
Published 2017

Impact of low-k devices on failure mode of flip chip tensile pull test

by Endut, Z., Ahmad, I., Swee, G.L.H., Sukemi, N.M.
Published 2017

Solder bump strength and failure mode of low-k flip chip device

by Endut, Z., Ahmad, I., Swee, G.L.H., Sukemi, N.M.
Published 2017

Trace Element Analysis of Pyrite and Arsenopyrite Using the LA-ICPMS Technique in Pulai, Central Belt of Peninsular Malaysia

by Ai Zamruddin, N.N.S., Zainal Abidin, N.S., Endut, Z., Makoundi, C., Lok, L.K., Ismail, M.S.
Published 2023

Lead corrosion and formation of lead oxides from a lead-air cell in methanesulfonic acid

by Basirun, Wan Jefrey, Saeed, I.M., Ghadimi, H., Ladan, M., Mahmoudian, M.R., Ebadi, M., Abdulrauf, L.B., Endut, Z.
Published 2016