Investigation of Sn3.5Ag and Sn3.8Ag0.7Cu Pb-free Alloys for BGA application on Ni/Au Finish

by Eu, P.-L., Ding, M., Ahmad, I.
Published 2017

A study on lead free SnAgCu solder system

by Hoh, H.J., Eu, P.L., Ding, M., Ahmad, I.
Published 2017

Lead-free flux effect in lead-free solder joint improvement

by Eu, P.L., Ding, M., Ahmad, I., Hoh, H.J., Hazlinda, K.
Published 2017

Effect of reflow profile (RSP Vs RTP) On Su/3.8Ag/0.7Cu solder joint strength

by Eu, P.-L., Ahmad, I., Jalar, A., Kamarudin, H., Majlis, B.Y.
Published 2017

Advantages & challenges of cold ball pull test vs conventional ball shear test in the assessment of lead-free solder joint performance

by Eu, P.L., Ding, M., Hoh, H.J., Ahmad, I., Hazlinda, K.
Published 2017

Process optimization approach in fine pitch Cu wire bonding

by Wong B.K., Yong C.C., Eu P.L., Yap B.K.
Published 2023

A comparative study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA spheres on Ni/Au finish

by Eu, P.-L., Ding, M., Hoh, H.-J., Rayos, J., Su, P., Lindsay, W., Chopin, S., Ahmad, I.
Published 2017

Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test

by Zhou, Ding, Haseeb, A.S. Md. Abdul, Andriyana, Andri, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, B.Y., Pang, X.S., Eu, P.L., Tan, L.C.
Published 2020