Temperature & zincation process effect on electrical resistivity of aluminum bond pad for under Bump Metallurgy (UBM)

by Kornain, Z., Ahmad, I., Omar, G.
Published 2017

Study of lifetime prediction of N-MOS transistor due to hot carrier effect

by Ahmad, I., Kornain, Z., Idros, M.F.M.
Published 2017

The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

by Amin, N., Cheah, A.Y., Kornain, Z., Ahmad, I.
Published 2017

The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

by Amin N., Cheah A.Y., Kornain Z., Ahmad I.
Published 2023

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

by Kornain, Z., Amin, N., Jalar, A., Cheah, A.Y., Ahmad, I.
Published 2017

Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA)

by Kornain Z., Amin N., Jalar A., Cheah A.Y., Ahmad I.
Published 2023