FCPBGA with SOP pad finishing a study of lead-free solder ball attach improvement

by Leng, E.P., Ling, W.T., Amin, N., Ahmad, I.
Published 2017

A comparison study of SAC405 and SAC387 lead-free solder ball alloy characteristic and solder joint system on Ni/Au finish

by Leng, E.P., Ding, M., Ahmad, I., Jalar, A.
Published 2017

Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing

by Ling, W.T., Leng, E.P., Amin, N., Ahmad, I.
Published 2017

A study of lead-free BGA backward compatibility through solderability testing at component level

by Leng, E.P., Ling, W.T., Amin, N., Ahmad, I.
Published 2017

Optimization of nickel thickness on substrate for TBGA using SAC387 solder material

by Ahmad, I., Majlis, B.Y., Jalar, A., Leng, E.P.
Published 2017

Pb-free BGA solder joint reliability improvement with Sn3.5Ag solder alloy on Ni/Au finish

by Leng, E.P., Ding, M., Lindsay, W., Chopin, S., Ahmad, I., Jalar, A.
Published 2017

Solder joint strength of lead free solders under multiple reflow and high temperature storage condition

by Ahmad, I., Jalar, A., Majlis, B.Y., Leng, E.P., San, Y.S.
Published 2017

A study of Ni thickness effect on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish

by Leng, E.P., Ding, M., Rayos, J., Ahmad, I., Jalar, A., Qiang, C.C.
Published 2017

The effect of Ni thickness on mechanical strength of Pb-free BGA spheres on selectively plated Ni/Au finish

by Leng, E.P., Ding, M., Rayos, J., Ahmad, I., Jalar, A., Qiang, C.C.
Published 2017

Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire

by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.
Published 2023

A study on inter-metallic compound formation and structure of lead free SnAgCu solder system

by Ahmad, I., Jiun, H.H., Leng, E.P., Majlis, B.Y., Jalar, A., Wagiran, R.
Published 2017

Improvement of Cu-Al bond integrity on low k pad structures

by Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.
Published 2023

Effect of Germanium addition to Sn3.5Ag lead free solder system for overall BGA package robustness improvement

by Leng, E.P., Ling, W.T., Ding, M., Amin, N., Ahmad, I., Han, T.Y., Haseeb, A.S.M.A.
Published 2017

A study of SnAgNiCo vs Sn3.8AgO.7Cu C5 lead free solder alloy on mechanical strength of BGA solder joint

by Leng, E.P., Ding, M., Ling, W.T., Amin, N., Ahmad, I., Lee, M.Y., Haseeb, A.S.M.A.
Published 2017

A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system

by Leng, E.P., Ding, M., Ling, W.T., Amin, N., Ahmad, I., Lee, M.Y., Haseeb, A.S.M.A.
Published 2017

BGA lead-free C5 solder system improvement by germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy

by Leng, E.P., Ling, W.T., Amin, N., Ahmad, I., Han, T.Y., Chiao, C.W., Haseeb, A.S.M.A.
Published 2017

C45 ultra low k wafer technology with Cu wire bonding

by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.
Published 2023

Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology

by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.
Published 2023