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NG WEI CHIN
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NG WEI CHIN
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NG WEI CHIN
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1
ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
by
NG
WEI
CHIN
Published 2019
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2
ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
by
NG
WEI
CHIN
Published 2019
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3
Effects of immersion zincation to the electroless nickel under-bump materials in microelectronics packaging
by
Ng
,
Wei
-
Chin
,
Ko, Tze-Man
,
Chen, William
,
Qi, Guo-Jun
Published 2014
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