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Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging Application

Effects of Volume Fraction and Particle Size Reinforcement Parameter on Microstructural and Thermal Properties of Copper Silicon Carbide (CuSiC) Composite for Electronic Packaging...

by Siti Amira Faisha Shikh Zakaria
Published 2012

Other Authors: “...Prof. Madya. Ir. Mohabattul Zaman Sns Bukhari...”
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