Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents

by Ho, Li Ngee, Dr., Teng, Fei Wu, Hiroshi, Nishikawa
Published 2014

Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

by Lin-Ngee, Ho, Teng, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, Ota, Koyu
Published 2011