Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

by Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S.
Published 2014

Hygro-thermo-mechanical modeling of mixed flip-chip and wire bond stacked die BGA module with molded underfill

by Zhang, X., Tee, T.Y., Ng, H.S., Teysseyre, J., Loo, S., Mhaisalkar, S., Ng, F.K., Lim, C.T., Du, X., Bool, E., Zhu, W., Chew, S.
Published 2014