Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire

by Kid W.B., Leng E.P., Seong L.B., Weily C., Kar Y.B.
Published 2023

C45 ultra low k wafer technology with Cu wire bonding

by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K., Siew C., Sivakumar, Kid W.B., Weily C.
Published 2023

Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology

by Leng E.P., Siong C.T., Seong L.B., Leong P., Gunasekaran, Song J., Mock K.S., Siew C.W., Sivakumar, Kid W.B., Weily C.
Published 2023