Heterogeneous wafer bonding technology and thin-film transfer technology-enabling platform for the next generation applications beyond 5g

由 Ren, Zhihao, Xu, Jikai, Le, Xianhao, Lee, Chengkuo
出版 2022

Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy

由 Xu, Jikai, Ren, Zhihao, Dong, Bowei, Liu, Xinmiao, Wang, Chenxi, Tian, Yanhong, Lee, Chengkuo
出版 2021