Assembling pore-rich FeP nanorods on the CNT backbone as an advanced electrocatalyst for oxygen evolution

by Yan, Ya, Zhao, Bin, Yi, Sung Chul, Wang, Xin
Published 2017

Studies on smart materials and material systems for mechanical applications

by Yi, Sung, Boey, Freddy Yin Chiang, Guo, Ningqun, Lin, R. M., Ling, S. F., Shu, Dong Wei, Tan, M. J., Yue, Chee Yoon, M. F. Ahmad, Hilton, H. H., Sze, K. Y., Vinson, J. R.
Published 2008

Chromosome-centric human proteome project (C-HPP): Chromosome 12

by Sakdithep Chaiyarit, Nilubon Singhto, Yi Ju Chen, Chia Ying Cheng, Wararat Chiangjong, Rattiyaporn Kanlaya, Henry H.N. Lam, Paleerath Peerapen, Ting Yi Sung, Phornpimon Tipthara, Akhilesh Pandey, Terence C.W. Poon, Yu Ju Chen, Ravi Sirdeshmukh, Maxey C.M. Chung, Visith Thongboonkerd
Published 2018

Nanoindentation studies of polyimide thin films on silicon substrates

by Yeo, Elaine
Published 2014

Thermo-mechanical and fatigue behaviors of solder joints

by Luo, Guangxing.
Published 2008

Moire measurement of IC packages

by Huang, Xia.
Published 2008

A finite element study of stresses developed in plastic encapsulated electronic packages during leadframe pull-out testing

by Ng, Shioo Wat.
Published 2008

Advanced electronic packaging substrate (ball grid array)

by Li, Jianjun.
Published 2008

An explicit hybrid-stabilised eighteen-node solid element for thin shell analysis

by Tay, Ming Hui.
Published 2009

Hygro-thermo-viscoelastic behaviour of molding compound materials

by Yu, Zeyan.
Published 2008

Bending and transformation toughening analyses of shape memory alloys

by Gao, Shan
Published 2008

Chemo-thermo-viscoelastic characterization and material modeling of electronic packaging moulding compound materials

by Neo, Raynard Guan Hock
Published 2008

Active control of flexible structures using distributed sensors and actuators

by Teo, Boon Kiat.
Published 2008