Discrete element simulation for pneumatic conveying of granular material

by Lim, E.W.C., Wang, C.-H., Yu, A.-B.
Published 2014

A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

by Yan, L.-L., Lee, C.-K., Yu, D.-Q., Yu, A.-B., Choi, W.-K., Lau, J.-H., Yoon, S.-U.
Published 2014

Integrated liquid cooling systems for 3-D stacked TSV modules

by Tang, G.Y., Tan, S.P., Khan, N., Pinjala, D., Lau, J.H., Yu, A.B., Vaidyanathan, K., Toh, K.C.
Published 2014

A 3mm endoscopic probe with integrated MEMS micromirror for optical coherence tomography bioimaging

by Mu, X.J., Zhou, G.Y., Feng, H.H., Xu, Y.S., Yu, A.B., Tan, C.W., Chen, K.W.S., Xie, J., Chau, F.S.
Published 2014