Genetic basis of disease: Studies of eicosanoids, and some complex disease traits

by Tay, A.
Published 2014

Real-time estimation and control of CD uniformity in lithography

by Tay, A.
Published 2014

Control of Photoresist Thickness Uniformity in the Microlithography Process

by Tay, A.
Published 2014

Struggling to get started

by Tay, A.
Published 2021

Retail employees’ performance expectations and perceptions: gaps between employees’ and supervisors’ evaluations

by Tay, A., Dar, O.L.
Published 2011

School cooperative societies in Malaysia: The inconspicuous and unique retail format with promising potentials

by Ong, L.D., Tay, A.
Published 2011

The effects of co-workers’ social undermining behaviour on employees’ work behaviours

by Ong, L.D., Tay, A.
Published 2015

The importance of allowing for the variation of thermal properties in the numerical computation of temperature distribution in machining

by Tay, A.A.O.
Published 2014

A review of methods of calculating machining temperature

by Tay, A.A.O.
Published 2014

Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages

by Tay, A.A.O.
Published 2014

Mechanics of interfacial delamination in IC packages undergoing solder reflow

by Tay, A.A.O.
Published 2014

Fracture mechanics analysis of delamination failures in I'C packages

by Tay, A.A.O.
Published 2014

The role of simulation in failure prediction and design optimization in electronics packaging

by Tay, A.A.O.
Published 2014

Modeling of delamination in IC packages

by Tay, A.A.O.
Published 2014

Influence of temperature humidity and defect location on delamination in plastic 1c packages

by Tay, A.A.O.
Published 2014

Influence of wafer warpage on photoresist film thickness and extinction coefficient measurements

by Wu, X., Tay, A.
Published 2014

Modeling of interfacial delamination in plastic IC packages under hygrothermal loading

by Tay, A.A.O.
Published 2014

Density forecasting: A survey

by Tay, A.S., Wallis, K.F.
Published 2011

Optimization of reliability of wafer level copper column interconnections using a variable compliance interconnect design

by Tay, A.A.O., Wei, S.
Published 2014

Intermittent spray cooling - Solution to optimize spray cooling

by Somasundaram, S., Tay, A.A.O.
Published 2014