Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS)
This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature o...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Penerbit Universiti Kebangsaan Malaysia
2020
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| Online Access: | http://journalarticle.ukm.my/16169/1/16.pdf http://journalarticle.ukm.my/16169/ https://www.ukm.my/jsm/malay_journals/jilid49bil12_2020/KandunganJilid49Bil12_2020.html |
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| Institution: | Universiti Kebangsaan Malaysia |
| Language: | English |