Interfacial reaction and dissolution behavior of Cu substrate in molten Sn-3.8Ag-0.7Cu in the presence of Mo nanoparticles

• المؤلفون الرئيسيون: Arafat, M.M., Haseeb, A.S. Md. Abdul, Johan, M.R.
• التنسيق: مقال
• منشور في: 2011
• الموضوعات: TA Engineering (General). Civil engineering (General)
• الوصول للمادة أونلاين: http://eprints.um.edu.my/5597/
• المؤسسة: Universiti Malaya

Purpose In electronic packaging, when solid copper comes in contact with liquid solder alloy, the former dissolves and intermetallic compounds (IMCs) form at the solid-liquid interface. The purpose of this paper is to study the effect of the presence of molybdenum nanoparticles on the dissolution of...