Analysis of foreign matter materials related to the die attach process of semiconductor device packaging / Tengku Elisa Bustaman.

• Main Author: Bustaman, Tengku Elisa
• Format: Thesis
• Published: 1999
• Subjects: TA Engineering (General). Civil engineering (General)
• Online Access: http://studentsrepo.um.edu.my/2859/1/PENDAHULUAN.pdf; http://studentsrepo.um.edu.my/2859/2/ABSTRACT.pdf; http://studentsrepo.um.edu.my/2859/3/KANDUNGAN.pdf; http://studentsrepo.um.edu.my/2859/4/BAB_1.pdf; http://studentsrepo.um.edu.my/2859/5/BAB_2.pdf; http://studentsrepo.um.edu.my/2859/6/BAB_3.pdf; http://studentsrepo.um.edu.my/2859/7/BAB_4.pdf; http://studentsrepo.um.edu.my/2859/8/BAB_5.pdf; http://studentsrepo.um.edu.my/2859/9/BIBLIOGRAFI.pdf; http://studentsrepo.um.edu.my/2859/10/LAMPIRAN.pdf; http://www.pendeta.um.edu.my/uhtbin/cgisirsi/x/P01UTAMA/0/5?searchdata1="Analysis of foreign matter materials related to the die attach process of semiconductor device packaging"{245}; http://studentsrepo.um.edu.my/2859/
• Institution: Universiti Malaya