Evaluation of electrical properties, oxidation and corrosion behavior of Fe and Bi added Sn-0.7 Cu lead-free solder alloy / Syed Hassan Abbas Jaffery
Before the legislations against the usage of lead, Sn-Pb solders were considered as the most efficient choice as a solder interconnect material in electronic and electrical industries. However, the toxicity of lead has raised serious ecological and human health concerns. Sn-Ag-Cu series is considere...
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| Format: | Thesis |
| Published: |
2017
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| Online Access: | http://studentsrepo.um.edu.my/8072/7/hassan.pdf http://studentsrepo.um.edu.my/8072/ |
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| Institution: | Universiti Malaya |
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