Temperature cycling analysis for ball grid array package using finite element analysis

Temperature cycling analysis for ball grid array package using finite element analysis

Link to publisher's homepage http://www.emeraldinsight.com/

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Bibliographic Details
Main Authors: Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Prof. Dr., Ghulam, Abdul Quadir
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2011
Subjects:
Finite element analysis
Joining processes
Soldering
Stress (materials)
Surface fitting
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/12182
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage http://www.emeraldinsight.com/

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