Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization

• Main Author: Lim Moy Fung
• Other Authors: Mohd Khairuddin Md Arshad (Advisor)
• Format: Learning Object
• Language: English
• Published: Universiti Malaysia Perlis 2008
• Subjects: Gold wire bonding; Gold ball bonds; Aluminum bond pad; Field Emission Scanning Electron Microscopy; Wire bonding (Electronic packaging); Intermetallic growth
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/1332
• Institution: Universiti Malaysia Perlis

The objective of this project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad. The study includes applying thermal storage conditions at 150 °C and 200 °C at various intervals time. The relationships betw...