Polysilicon Process Development – The Effect Of PECVD Process Parameters On The Film Characteristics

Thin polycrystalline silicon film has been used in the wide range of applications in the production of integrated circuits and other electronic products. Traditionally, polycrystalline silicon is deposited using Low Pressure Chemical Vapor Deposition (LPCVD) process at temperatures around 600 – 7...

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主要作者: Mujahidun Mashuri
其他作者: Ramzan Mat Ayub (Advisor)
格式: Learning Object
語言:English
出版: Universiti Malaysia Perlis 2008
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在線閱讀:http://dspace.unimap.edu.my/xmlui/handle/123456789/1350
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機構: Universiti Malaysia Perlis
語言: English