Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition

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Bibliographic Details
Main Author:	Norahmad Barzrul Basaruddin
Other Authors:	Mohd Khairuddin Md Arshad (Advisor)
Format:	Learning Object
Language:	English
Published:	Universiti Malaysia Perlis 2008
Subjects:	AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits > Design and construction Integrated circuits > Materials
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/1351
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Institution:	Universiti Malaysia Perlis
Language:	English

id	my.unimap-1351
record_format	dspace
spelling	my.unimap-13512008-07-01T03:59:31Z Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition Norahmad Barzrul Basaruddin Mohd Khairuddin Md Arshad (Advisor) AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits -- Design and construction Integrated circuits -- Materials Access is limited to UniMAP community. The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited on top on AlSi first. To deposit the gold layer, there are seven set-up process steps prior completion of under bump metallurgy (UBM) deposition, aluminum bond pad activation, first zincation, zinc removal, second zincation, electroless nickel and immersion gold. Then the completed sample needs to be analyzed. To obtain the surface roughness and morphology of each deposition, the Atomic Force Microscopy (AFM) and Scanning Electron Microscope (SEM) were used. The first zincation process has high surface roughness but preserved surface morphology of initial thin film surface. The second zincation provides the improved surface roughness due to the replacement aluminum layer with ion zinc in the solution. 2008-07-01T03:59:31Z 2008-07-01T03:59:31Z 2007-03 Learning Object http://hdl.handle.net/123456789/1351 en Universiti Malaysia Perlis School of Microelectronic Engineering
institution	Universiti Malaysia Perlis
building	UniMAP Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaysia Perlis
content_source	UniMAP Library Digital Repository
url_provider	http://dspace.unimap.edu.my/
language	English
topic	AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits -- Design and construction Integrated circuits -- Materials
spellingShingle	AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits -- Design and construction Integrated circuits -- Materials Norahmad Barzrul Basaruddin Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
description	Access is limited to UniMAP community.
author2	Mohd Khairuddin Md Arshad (Advisor)
author_facet	Mohd Khairuddin Md Arshad (Advisor) Norahmad Barzrul Basaruddin
format	Learning Object
author	Norahmad Barzrul Basaruddin
author_sort	Norahmad Barzrul Basaruddin
title	Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
title_short	Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
title_full	Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
title_fullStr	Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
title_full_unstemmed	Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
title_sort	characterization of electroless under bump metallurgy for alsi bond pad composition
publisher	Universiti Malaysia Perlis
publishDate	2008
url	http://dspace.unimap.edu.my/xmlui/handle/123456789/1351
_version_	1643787262902665216

Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition

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