Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
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Hindawi Publishing Corporation
2013
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my.unimap-260722013-06-25T06:55:50Z Technical barriers and development of Cu wirebonding in nanoelectronics device packaging C., L. Gan E., K. Ng B., L. Chan Uda, Hashim, Prof. Dr. F., C. Classe clgan pgg@yahoo.com Nanoelectronics Wirebonding Cu wire Link to publisher's homepage at http://www.hindawi.com Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased HAST) reliability performance of Cu wire used in fine-pitch BGA package. In-depth failure analysis has been carried out to identify the failure mechanism under various assembly conditions. Obviously green mold compound, low-halogen substrate, optimized Cu bonding parameters, assembly staging time after wirebonding, and anneal baking after wirebonding are key success factors for Cu wire development in nanoelectronic packaging. Failure mechanisms of Cu ball bonds after UHAST test and CuAl IMC failure characteristics have been proposed and discussed in this paper. 2013-06-25T06:55:50Z 2013-06-25T06:55:50Z 2012 Article Journal of Nanomaterials, vol. 2012, 2012, pages 1-7 1687-4110 http://www.hindawi.com/journals/jnm/2012/173025/ http://hdl.handle.net/123456789/26072 en Hindawi Publishing Corporation |
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Universiti Malaysia Perlis |
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Asia |
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Malaysia |
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Universiti Malaysia Perlis |
| content_source |
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http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Nanoelectronics Wirebonding Cu wire |
| spellingShingle |
Nanoelectronics Wirebonding Cu wire C., L. Gan E., K. Ng B., L. Chan Uda, Hashim, Prof. Dr. F., C. Classe Technical barriers and development of Cu wirebonding in nanoelectronics device packaging |
| description |
Link to publisher's homepage at http://www.hindawi.com |
| author2 |
clgan pgg@yahoo.com |
| author_facet |
clgan pgg@yahoo.com C., L. Gan E., K. Ng B., L. Chan Uda, Hashim, Prof. Dr. F., C. Classe |
| format |
Article |
| author |
C., L. Gan E., K. Ng B., L. Chan Uda, Hashim, Prof. Dr. F., C. Classe |
| author_sort |
C., L. Gan |
| title |
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging |
| title_short |
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging |
| title_full |
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging |
| title_fullStr |
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging |
| title_full_unstemmed |
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging |
| title_sort |
technical barriers and development of cu wirebonding in nanoelectronics device packaging |
| publisher |
Hindawi Publishing Corporation |
| publishDate |
2013 |
| url |
http://dspace.unimap.edu.my/xmlui/handle/123456789/26072 |
| _version_ |
1643794830362411008 |