The thermal expansion behaviors of Cu-SiCp composites

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Bibliographic Details
Main Authors:	Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al-Bakri, Abdullah
Other Authors:	azmikamardin@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Copper matrix composites Electroless copper Packaging materials Porosity Silicon carbide particles Thermal expansion
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/32812
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Institution:	Universiti Malaysia Perlis
Language:	English

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