Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
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Hindawi Publishing Corporation
2014
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my.unimap-331002014-03-25T06:59:29Z Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging Chong, Leong Gan E., K. Ng Bak, Lee Chan Classe, Francis Kwuanjai, T. Uda, Hashim, Prof. Dr. clgan_pgg@yahoo.com mflim@yahoo.com gchongleong@gmail.com chong-leong.gan@spansion.com uda@unimap.edu.my Cu wires Nanoscale device Diffusion kinetics Wire bonds Link to publisher's homepage at http://www.hindawi.com/ Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with bias) and UHAST (unbiased HAST) wearout reliability performance of Au and PdCu wires used in fine pitch BGA packages. In-depth failure analysis has been carried out to identify the failure mechanism under various wearout conditions. Intermetallic compound (IMC) diffusion constants and apparent activation energies (E aa) of both wire types were investigated after high temperature storage life test (HTSL). Au bonds were identified to have faster IMC formation, compared to slower IMC growth of PdCu. PdCu wire was found to exhibit equivalent or better wearout reliability margin compared to conventional Au wire bonds. Failure mechanisms of Au, Cu ball bonds post-HAST and UHAST tests are been proposed, and both Au and PdCu IMC diffusion kinetics and their characteristics are discussed in this paper. 2014-03-25T06:59:29Z 2014-03-25T06:59:29Z 2013 Article Journal of Nanomaterials, vol. 2013, 2013, pages 1-9 1687-4110 http://www.hindawi.com/journals/jnm/2013/486373/ http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100 en Hindawi Publishing Corporation |
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English |
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Cu wires Nanoscale device Diffusion kinetics Wire bonds |
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Cu wires Nanoscale device Diffusion kinetics Wire bonds Chong, Leong Gan E., K. Ng Bak, Lee Chan Classe, Francis Kwuanjai, T. Uda, Hashim, Prof. Dr. Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging |
| description |
Link to publisher's homepage at http://www.hindawi.com/ |
| author2 |
clgan_pgg@yahoo.com |
| author_facet |
clgan_pgg@yahoo.com Chong, Leong Gan E., K. Ng Bak, Lee Chan Classe, Francis Kwuanjai, T. Uda, Hashim, Prof. Dr. |
| format |
Article |
| author |
Chong, Leong Gan E., K. Ng Bak, Lee Chan Classe, Francis Kwuanjai, T. Uda, Hashim, Prof. Dr. |
| author_sort |
Chong, Leong Gan |
| title |
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging |
| title_short |
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging |
| title_full |
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging |
| title_fullStr |
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging |
| title_full_unstemmed |
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging |
| title_sort |
wearout reliability and intermetallic compound diffusion kinetics of au and pdcu wires used in nanoscale device packaging |
| publisher |
Hindawi Publishing Corporation |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33100 |
| _version_ |
1643797067543347200 |