Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives

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Bibliographic Details
Main Authors: Ho, Li Ngee, Dr., Hiroshi, Nishikawa
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Springer Science+Business Media New York 2014
Subjects:
Adhesive materials
Conductive fillers
Electrical and mechanical properties
Electrical conductivity
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://link.springer.com/

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