Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
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Springer Science+Business Media New York
2014
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my.unimap-331862017-11-29T06:59:19Z Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives Ho, Li Ngee, Dr. Hiroshi, Nishikawa holingee@yahoo.com lnho@unimap.edu.my Adhesive materials Conductive fillers Electrical and mechanical properties Electrical conductivity Link to publisher's homepage at http://link.springer.com/ Effects of post curing and silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper (Cu) filled electrically conductive adhesives (ECAs) were studied. Micron-sized Cu particles were used as conductive fillers and polyurethane resin was applied as the adhesive material. Significant differences could be observed on the as cured electrical resistivity and shear strength of the Cu filled ECAs joints prepared with different silane coupling agents. Silane coupling agents functionalized with epoxy groups yielded the lowest electrical resistivity and highest shear strength among the ECAs in this study. Besides, effect of post-curing at 170 C for 1 h on the ECAs was also investigated. Results showed that ECAs after post-curing exhibited enhanced electrical conductivity and shear strength compared to the as cured ECAs. 2014-03-28T03:29:52Z 2014-03-28T03:29:52Z 2013-06 Article Journal of Materials Science: Materials in Electronics, vol. 24(6), 2013, pages 2077-2081 0957-4522 http://link.springer.com/article/10.1007%2Fs10854-012-1059-0 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186 en Springer Science+Business Media New York |
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English |
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Adhesive materials Conductive fillers Electrical and mechanical properties Electrical conductivity |
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Adhesive materials Conductive fillers Electrical and mechanical properties Electrical conductivity Ho, Li Ngee, Dr. Hiroshi, Nishikawa Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| description |
Link to publisher's homepage at http://link.springer.com/ |
| author2 |
holingee@yahoo.com |
| author_facet |
holingee@yahoo.com Ho, Li Ngee, Dr. Hiroshi, Nishikawa |
| format |
Article |
| author |
Ho, Li Ngee, Dr. Hiroshi, Nishikawa |
| author_sort |
Ho, Li Ngee, Dr. |
| title |
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| title_short |
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| title_full |
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| title_fullStr |
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| title_full_unstemmed |
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| title_sort |
influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives |
| publisher |
Springer Science+Business Media New York |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33186 |
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1643802745784762368 |