Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate

Link to publisher's homepage at http://www.scientific.net/

Saved in:
Bibliographic Details
Main Authors: Mohd Arif Anuar, Mohd Salleh, Noraniza, Saud, S.I, Najib
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Composite
Growth kinetics
Intermetallic
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/dspace/handle/123456789/34876

Similar Items