Graphite as an intermetallic compound (IMC) substitution for a robust solder joint

• Main Authors: Fatin Afeeqa, Mohd Sobri, Norhayanti, Mohd Nasir, Rita, Mohd Said, Mohd Izrul Izwan, Ramli, Muhammad Hafiz, Zan@Hazizi, Azmi, Kamardin, Mohd Arif Anuar, Mohd Salleh
• Other Authors: Fatin Afeeqa Binti Mohd Sobri
• Format: Image
• Language: English
• Published: Universiti Malaysia Perlis (UniMAP) 2015
• Subjects: Diploma Programe Coordination Unit; Intermetallic compound (IMC); Research > UniMAP; Technical innovations > UniMAP; International Engineering Invention & Innovation Exhibition (i-ENVEX 2015); Solder
• Online Access: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40501
• Institution: Universiti Malaysia Perlis

The 6th International Engineering Invention & Innovation Exhibition 2015 (i-ENVEX 2015) was organized by ENVEX Young Researcher Club (EYReC), University Malaysia Perlis (UniMAP) and Ministry of Higher Education (MOHE), Malaysia on 17th - 19th April 2015, at UniMAP Main Campus, Pauh Putra, Perlis...