Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
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IOP Publishing Ltd
2022
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my.unimap-745842022-03-07T06:42:46Z Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review Mohd Arif Anuar, Mohd Salleh Sandu, I G Mohd Mustafa Al Bakri, Abdullah Sandu, I arifanuar@unimap.edu.my Nikel (Ni) Solder Link to publisher's homepage at https://iopscience.iop.org/ In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of two or more addition of microalloying. By microalloying addition, the solidification structure can be modified. This paper reviews the addition of Ni as microalloying in Sn-Cu lead free solder. Small additions of Ni resulted with an improvement of solder in microstructure and in intermetallic compounds. The stabilization of hexagonal structure of Cu6Sn5 in lead-free solder alloys occurred due to present of Ni 2022 2022-03-07T06:42:46Z 2022-03-07T06:42:46Z 2017-06 Article IOP Conference Services: Material Sciences Engineering, vol.209, 2017, 7 pages http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584 https://doi.org/10.1088/1757-899x/209/1/012084 en International Conference on Innovative Research (ICIR Euroinvent 2017); IOP Publishing Ltd |
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Universiti Malaysia Perlis |
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Asia |
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Malaysia |
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Universiti Malaysia Perlis |
| content_source |
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http://dspace.unimap.edu.my/ |
| language |
English |
| topic |
Nikel (Ni) Solder |
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Nikel (Ni) Solder Mohd Arif Anuar, Mohd Salleh Sandu, I G Mohd Mustafa Al Bakri, Abdullah Sandu, I Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review |
| description |
Link to publisher's homepage at https://iopscience.iop.org/ |
| author2 |
arifanuar@unimap.edu.my |
| author_facet |
arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Sandu, I G Mohd Mustafa Al Bakri, Abdullah Sandu, I |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Sandu, I G Mohd Mustafa Al Bakri, Abdullah Sandu, I |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review |
| title_short |
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review |
| title_full |
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review |
| title_fullStr |
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review |
| title_full_unstemmed |
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review |
| title_sort |
nickel (ni) microalloying additions in sn-cu lead-free solder. short review |
| publisher |
IOP Publishing Ltd |
| publishDate |
2022 |
| url |
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584 |
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1729704777968779264 |