Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders

• Main Authors: Norainiza, Saud, Azman, Jalar
• Other Authors: [e-mail]
• Format: Working Paper
• Language: English
• Published: Universiti Malaysia Perlis 2010
• Subjects: Sn-rich phase; Sn-Ag-Cu; Sn-Ag; Annealing; Diffusion; Solder pastes; Microelectronics packaging; Microelectronics
• Online Access: http://dspace.unimap.edu.my/xmlui/handle/123456789/7483
• Institution: Universiti Malaysia Perlis

Organized by School of Materials Engineering & Sustainable Engineering Research Cluster, 1st - 2nd December 2009 at Putra Brasmana Hotel, Kuala Perlis, Perlis.