Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

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Bibliographic Details
Main Authors: R., Izamshah, N., Suieb, M. S., Kasim, M. S., A. Aziz, M. S., Yob, S. A., Sundi, R., Zamri, R. S. A., Abdullah
Other Authors: izamshah@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
Electroplating
Manufacturing process
Physical shielding
Precision engineering
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798
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Institution: Universiti Malaysia Perlis
Language: English
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Summary:Link to publisher's homepage at http://ijneam.unimap.edu.my

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