Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig

Transient thermal analysis on convection process of circular plate used in hot surface deposition test rig

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Bibliographic Details
Main Authors: M. Z., Akop, F., Jikol, Y. M., Arifin, M. A., Salim, S. G., Herawan
Other Authors: zaid@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
Aluminum alloy
Convection
Deposits
Room temperature
Transient thermal
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799
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Institution: Universiti Malaysia Perlis
Language: English

Internet

http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75799

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