Characterization study for polymer core solder balls under AC and TC reliability test
Ball grid arrays; Diffusion; Drops; Electronics packaging; Hazardous materials; Hazards; Industrial electronics; Lead-free solders; Polymers; Reliability; Semiconductor device manufacture; Shear strength; Soldered joints; Testing; Thermal conductivity; Thickness measurement; Characterization studies...
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| Main Authors: | , , |
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| Format: | Conference Paper |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
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| Institution: | Universiti Tenaga Nasional |
| Summary: | Ball grid arrays; Diffusion; Drops; Electronics packaging; Hazardous materials; Hazards; Industrial electronics; Lead-free solders; Polymers; Reliability; Semiconductor device manufacture; Shear strength; Soldered joints; Testing; Thermal conductivity; Thickness measurement; Characterization studies; Electronic application; Mechanical requirements; Polymer core solder balls; Reliability performance; Reliability test; Restriction of hazardous Substances; Semiconductor industry; Soldering |
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