A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system

• المؤلفون الرئيسيون: Leng, E.P., Ding, M., Ling, W.T., Amin, N., Ahmad, I., Lee, M.Y., Haseeb, A.S.M.A.
• التنسيق: مقال
• اللغة: English
• منشور في: 2017
• الوصول للمادة أونلاين: http://dspace.uniten.edu.my:80/jspui/handle/123456789/5280

A study was conducted on BGA lead-free C5 solder joint system to compare SnAgNiCo versus conventional Sn3.8Ag0.7Cu solder alloy. This study showed that SnAgNiCo C5 solder system performed better than Sn3.8Ag0.7Cu in terms of joint strength and brittle mode failure. Shear and pull strength was measur...