Solder joint strength of lead free solders under multiple reflow and high temperature storage condition
Solder Joining is one of the interconnection methods in microelectronic packaging. The robustness of the solder ball attachment to the packages determines the solder joint strength between solders and the Under-Bump Metallization (UBM). This paper discussed the solder joint shear strength between Sn...
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| Main Authors: | , , , , |
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| Format: | |
| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5310 |
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| Institution: | Universiti Tenaga Nasional |