Intermetallic growth of SAC237 solder paste reinforced with 0.01wt.% multi-walled carbon nanotubes
The formation of intermetallic compound (IMC) layer at the interfaces of pad finishes have been studied. The growth of IMC layer after as reflow process and its properties were also discussed. In this study, solder alloy SAC237 (Sn: 99 wt.%, Ag: 0.3 wt.%, Cu: 0.7 wt.%) reinforced with 0.01 wt.% Mult...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2015
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| Online Access: | http://psasir.upm.edu.my/id/eprint/66182/1/Intermetallic%20growth%20of%20SAC237%20solder%20paste%20reinforced%20with%200.01wt.%25%20multi-walled%20carbon%20nanotubes.pdf http://psasir.upm.edu.my/id/eprint/66182/ |
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| Institution: | Universiti Putra Malaysia |
| Language: | English |