Copper Layer Sheet Resistance Evolution As A Function Of Post-Seed Process Self-Annealing Time

• Main Authors: Abd Rahman, Md Nizam, Muhamad, Mohd Razali, Sulaiman, Mohd Amri, Hashim, Zarifah Syazana, Fadzil, Ahmad Anuar, Budi, Esmar
• Format: Article
• Language: English
• Published: Penerbit Universiti Teknikal Malaysia Melaka 2018
• Online Access: http://eprints.utem.edu.my/id/eprint/24830/2/4894-13095-1-PB-%20CU%20LAYER.PDF; http://eprints.utem.edu.my/id/eprint/24830/; https://jamt.utem.edu.my/jamt/article/view/4894/3592
• Institution: Universiti Teknikal Malaysia Melaka

Copper layer metallization is one of the important processes in integrated circuit manufacturing. One of the issues faced in this process is the proneness of Cu interface diffusion as well as surface oxidation which degrade some of the Cu thin film properties. Due to this concern, most integrated ci...