Investigation Of Cu Interconnect Bulk Resistivity Deterioration As A Function Of Annealing Time

• Main Authors: Abd Rahman, Md Nizam, Muhamad, Razali, Ahmad, Anuar Fadli, Raj, Adrian
• Format: Technical Report
• Language: English
• Published: UTeM 2020
• Online Access: http://eprints.utem.edu.my/id/eprint/25483/1/Investigation%20Of%20Cu%20Interconnet%20Bulk%20Resistivity%20Deterioration%20As%20A%20Function%20Of%20Annealing%20Time.pdf; http://eprints.utem.edu.my/id/eprint/25483/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118463
• Institution: Universiti Teknikal Malaysia Melaka

Copper layer metallization is one of the important processes in integrated circuit manufacturing. One of the issues faced in this process is the proneness of Cu interface diffusion as well as surface oxidation which degrade some of the Cu thin film properties. Due to this concern, most integrated ci...