An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly

An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly

Combining the flexibility and stretchability of printed flexible circuits (PFC) such as PET and TPU with water repellent characteristics may improve the functionality of printed circuit for electronic packaging. Water repellent characteristics using ceramic-based coating may protect the surface from...

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Bibliographic Details
Main Authors: Omar, Ghazali, Samsudin, Zambri, Nordin, Mohd Nur Azmi, Kamarolzaman, Anita Akmar, Masripan, Nor Azmmi, Salim, Mohd Azli, Mansor, Muhd Ridzuan, Wu, Jonathan Wei Ping
Format: Technical Report
Language:English
Published: UTeM 2019
Online Access:http://eprints.utem.edu.my/id/eprint/25485/1/An%20Investigation%20Of%20Superhydrophobic%20Waterproofing%20For%20Electronic%20Assembly.pdf
http://eprints.utem.edu.my/id/eprint/25485/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118484
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Institution: Universiti Teknikal Malaysia Melaka
Language: English

Internet

http://eprints.utem.edu.my/id/eprint/25485/1/An%20Investigation%20Of%20Superhydrophobic%20Waterproofing%20For%20Electronic%20Assembly.pdf
http://eprints.utem.edu.my/id/eprint/25485/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118484

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