An Investigation Of Superhydrophobic Waterproofing For Electronic Assembly

• Main Authors: Omar, Ghazali, Samsudin, Zambri, Nordin, Mohd Nur Azmi, Kamarolzaman, Anita Akmar, Masripan, Nor Azmmi, Salim, Mohd Azli, Mansor, Muhd Ridzuan, Wu, Jonathan Wei Ping
• Format: Technical Report
• Language: English
• Published: UTeM 2019
• Online Access: http://eprints.utem.edu.my/id/eprint/25485/1/An%20Investigation%20Of%20Superhydrophobic%20Waterproofing%20For%20Electronic%20Assembly.pdf; http://eprints.utem.edu.my/id/eprint/25485/; https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=118484
• Institution: Universiti Teknikal Malaysia Melaka

Combining the flexibility and stretchability of printed flexible circuits (PFC) such as PET and TPU with water repellent characteristics may improve the functionality of printed circuit for electronic packaging. Water repellent characteristics using ceramic-based coating may protect the surface from...