Analysis on bonding wires of Au-Coated Ag alloy for IBGA automotive application

• Main Authors: Palagud, Jose, Lim, T.S., Jasmee, Solehah, Masdzarif, Nur Diana Izzani, Wang, S.W., Hoo, K.I., Omar, Ghazali
• Format: Conference or Workshop Item
• Language: English
• Published: 2023
• Online Access: http://eprints.utem.edu.my/id/eprint/28007/1/Analysis%20on%20bonding%20wires%20of%20Au-Coated%20Ag%20alloy%20for%20IBGA%20automotive%20application.pdf; http://eprints.utem.edu.my/id/eprint/28007/; https://ieeexplore.ieee.org/document/10457870
• Institution: Universiti Teknikal Malaysia Melaka

In semiconductor packaging, wire bonds have been an important interconnect, and over the years, the use of other wire bonds other than Gold (Au) such as Silver (Ag) and Copper (Cu) wires has started, driven by the lower cost offered. Unfortunately, these bonding wires cannot surpass the superior pro...