Laser microwelding for reliable packaging of photonic devices

Laser microwelding for reliable packaging of photonic devices

Investigations and analysis of various parameters that contribute for increasing the efficiency of laser diode to single mode fiber coupling using lens coupling scheme are presented in this paper. The low power laser weldability of Invar, Kovar and stainless steel 304 alloys make them suitable as th...

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Bibliographic Details
Main Authors: Fadhali, Mohamed, Toto, Saktioto, Zainal, Jasman, Munajat, Yusof, Ali, Jalil, Abd Rahman, Rosly
Format: Article
Language:English
Published: 2007
Subjects:
T Technology (General)
QC Physics
Online Access:http://eprints.utm.my/id/eprint/5870/1/LASER_MICROWELDING_FOR_RELIABLE_PACKAGING_OF_PHOTONIC_DEVICES.pdf
http://eprints.utm.my/id/eprint/5870/
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Institution: Universiti Teknologi Malaysia
Language: English

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http://eprints.utm.my/id/eprint/5870/1/LASER_MICROWELDING_FOR_RELIABLE_PACKAGING_OF_PHOTONIC_DEVICES.pdf
http://eprints.utm.my/id/eprint/5870/

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