Effect of etching as pre-treatment for electroless copper plating on silicon wafer

• Main Authors: Shahidin, S. A. M., Fadil, N. A., Yusop, M. Z., Tamin, M. N., Osman, S. A.
• Format: Article
• Published: Penerbit UTM Press 2017
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/76686/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85032275598&doi=10.11113%2fjt.v79.10640&partnerID=40&md5=b5b98ce65503279f0aa063e6c1289236
• Institution: Universiti Teknologi Malaysia

Metallic coatings, such as copper films can be easily deposited on semiconductor materials like silicon wafer without prior surface pre-treatment using the electroless process. However, the adhesion of the copper film can be very weak and can easily peels off. In this study, the effect of etching in...