An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study

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Bibliographic Details
Main Authors:	Hoe, H.K., Prakash, J., Kamaruddin, S., Seng, O.K.
Format:	Article
Published:	Universitat Politecnica de Catalunya 2019
Online Access:	https://www.scopus.com/inward/record.uri?eid=2-s2.0-85071756428&doi=10.3926%2fjiem.2742&partnerID=40&md5=960854de658600eaae54764ccfb18ea2 http://eprints.utp.edu.my/25242/
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Institution:	Universiti Teknologi Petronas

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