Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for high power led packaging
Persistently growing High-power LED packaging is used in various flux applications especially microelectronics, aerospace, oil and gas as well. Thermo-compression die-attach layer is perceived to be the most critical element in highpower LED packages as the increase in operating temperature requires...
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| Main Authors: | , |
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| Format: | Article |
| Published: |
Asian Research Publishing Network
2016
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85009186301&partnerID=40&md5=09c07e50122f2c8018629783b9b6963b http://eprints.utp.edu.my/25331/ |
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| Institution: | Universiti Teknologi Petronas |
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