Design of AlN-based micro-channel heat sink in direct bond copper for power electronics packaging

• المؤلفون الرئيسيون: Yin, Shan, Tseng, King Jet, Zhao, Jiyun
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/100180; http://hdl.handle.net/10220/17795

A single-phase, laminar flow, rectangular, and AlN-based micro-channel heat sink (MCHS) with water coolant has been designed and optimized for power electronics packaging. By fabricating micro-channels in the AlN-layer of direct bond copper, the heat conduction path is minimized and high cooling per...