Sharif, A., Gan, C. L., Chen, Z., & Engineering, S. o. M. S. &. (2014). Transient liquid phase Ag-based solder technology for high-temperature packaging applications.
Chicago Style CitationSharif, Ahmed, Chee Lip Gan, Zhong Chen, and School of Materials Science & Engineering. Transient Liquid Phase Ag-based Solder Technology for High-temperature Packaging Applications. 2014.
MLA CitationSharif, Ahmed, Chee Lip Gan, Zhong Chen, and School of Materials Science & Engineering. Transient Liquid Phase Ag-based Solder Technology for High-temperature Packaging Applications. 2014.
Warning: These citations may not always be 100% accurate.