Sharif, A., Gan, C. L., Chen, Z., & Engineering, S. o. M. S. &. (2014). Transient liquid phase Ag-based solder technology for high-temperature packaging applications.
Chicago Style CitationSharif, Ahmed, Chee Lip Gan, Zhong Chen, and School of Materials Science & Engineering. Transient Liquid Phase Ag-based Solder Technology for High-temperature Packaging Applications. 2014.
MLA引文Sharif, Ahmed, Chee Lip Gan, Zhong Chen, and School of Materials Science & Engineering. Transient Liquid Phase Ag-based Solder Technology for High-temperature Packaging Applications. 2014.
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